The Internet of Things

By 2018 the number of Internetconnected devices comprising the Internet-of-Everything is projected to reach a staggering 23 billion, outnumbering the world’s population by nearly 2.5 to 1. Of these devices, 14 billion will be PCs, smartphones, tablets, wearables, connected TVs and cars, while the remaining 9 billion will make up the Internet-of-Things across the consumer, government, and enterprise sectors.

Building Blocks for the Internet of Things

In our lifetime we will experience life with a trillion-node network, and Texas Instruments is the only semiconductor company with all of the building blocks to enable the IoT.

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CC3200

CC3200

CC2640

CC2640

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Internet of Things

The complexity and broad reach of the IoT raises the bar on what is required from TI technology.

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IoT Development Phases & Test Challenges

It is enabled by broad availability of processing power, sensor components, fast prototyping, and the omnipresence of the Internet. As new IoT devices rush to market the traditional design cycle is being reinvented focusing on more speed of integration and less on traditional digital design.

This changing process is creating new test requirements and emerging application spaces. Each phase has unique testing needs requiring a breadth of powerful, modern test tools.

IoT Test Challenges

  1. Node Development – Functional test, data analysis, wireless validation
  2. Device Integration – Data formatting, coordination, and RF debug
  3. Network Connectivity – Wi-Fi Integration, network optimization, and interference
  4. EMC PreCompliance – Radiated emissions and interference as you design and build

Learn more about IoT applications and Rigol’s test solutions:

IoT Development Phases DS1000Z photo

Helping you drive the future
of automotive electronics

For more than fifty years, Murata has been developing all of those little things that make a huge difference in automotive technologies.

Wireless Modules

  • Wi-Fi®
  • Embedded Wi-Fi®
  • BT/BLE
  • 900MHz
  • Combo Modules

Power Solutions

  • AC-DC Power Supplies
  • DC-DC Converters
  • Micro DC-DCs
  • Power Blocks

Components

  • Capacitors
  • Buzzers, Sounders
  • Noise Suppression Products
  • ESD Protection
  • EMI Filters
  • Inductors
  • Microwave Components
  • Trimmer Potentiometers
  • RFID & NFC Technologies
  • Timing Devices

Sensors

  • MEMS Accelerometer
  • MEMS Inclinometer
  • MEMS Gyro & Combo
  • AMR Switches
  • Pyro Infrared
  • Ultrasonic
  • Thermistors
  • Shock
  • Rotary Position
  • Magnetic

For further details visit www.murata.com

TAIYO YUDEN's Bluetooth Smart and ANT Module for IoT

TAIYO YUDEN’s EYSHCNZXZ is a powerful Bluetooth Smart and ANT module based on Nordic Semiconductor's nRF52832 SoC. The module is FCC, IC and TELEC certified to help engineers mitigate design risks and reduce time-to-market. Its small footprint also makes it suitable for a wide range of application.

Key Features:

  • Integrated Chip Antenna and 32kHz Crystal
  • FCC/IC/TELEC Certified
  • CE Conducted Test Report Available
  • 4dBm Output Power
  • ARM Cortex M4F
  • Memory: 512kB of Flash, 64kB of RAM
  • Interface: SPI/UART, I2C, PDM and 12-bit ADC
  • NFC-A Type-2 for Touch-to-Pair
  • Over-the-Air Firmware Updates
  • Size: 9.6mm x 12.9mm x 2.0mm
  • Operating Temp Range: -25 to 75 deg-C

Applications:

  • IoT
  • Wearables
  • Remote Control
  • Smart Toys
  • Lighting Control
  • Sensors
  • Home and Building Automation

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Bluetooth Smart